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中空玻璃微球/聚酰亚胺复合薄膜的制备及性能研究

Preperation and performance of HGM-polyimide composite film
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摘要 采用硅烷偶联剂KH550和KH560对中空玻璃微球进行改性,以均苯四甲酸二酐和4,4'-二氨基二苯醚为原材料,N,N-二甲基乙酰胺为溶剂,采用原位聚合法制得中空玻璃微球/聚酰亚胺复合薄膜。通过红外光谱和扫描电子显微镜对中空玻璃微球的改性情况进行表征。结果表明:硅烷偶联剂成功接枝到了玻璃微球表面。随着玻璃微球质量分数的提高,复合薄膜的力学性能在一定程度上有所下降,但介电常数却有明显的降低。填充未改性空心中空玻璃微球的复合薄膜,其介电常数从3.5降至2.4,KH550改性后的复合薄膜的介电常数最低可以达到2.0左右。 The surface of hollow glass microspheres(HGM)was modified with different silane coupling agents KH550and KH560.The hollow glass microspheres/polyimide composite films were prepared by in-situ polymerization using pyromellitic dianhydride and 4,4'-diaminodiphenyl ether as raw materials and N,N-dimethylacetamide as solvent.The modification of microspheres was characterized by.FT-IR and scanning electron microscope(SEM).The results showed that silane coupling agents are successfully grafted onto microsphere surface.With the doping content of microspheres increased,the mechanical properties decreased to a certain extent.However,the dielectric properties of composite films were reduced obviously.The dielectric constant of film filled with unmodified hollow glass microspheres decreased from 3.5 to 2.4.The minimum dielectric constant of film modified by KH550could reach about 2.
作者 马馨雨 刘立柱 翁凌 董馨茜 Ma Xinyu;Liu Lizhu;Weng Ling;Dong Xinqian(School of Materials Science and Engineering,Harbin University of Science and Technology, Harbin 150040;Key Laboratory of Engineering Dielectric and Its Application, Ministry of Education,Harbin University of Science and Technology,Harbin 150080)
出处 《化工新型材料》 CSCD 北大核心 2018年第12期104-107,共4页 New Chemical Materials
关键词 中空玻璃微球 硅烷偶联剂 聚酰亚胺 复合薄膜 介电常数 hollow glass microsphere (HGM) silane coupling agent polyimide composite film dielectric constant
作者简介 马馨雨(1994-),女,硕士研究生,主要研究方向为高分子材料的制备及改性;联系人:刘立柱,教授。
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